Modeling and Simulation for Microelectronic Packaging Assembly by Yong Liu Hardcover Book
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Sponsorisé Modeling and Simulation for Microelectronic Packaging Assembly by Yong Liu Hardcover Book
147.76 EUR
Prix mis à jour le: 22-04-2026 11:02:42
147.76 EUR
Prix mis à jour le: 22-04-2026 11:02:42 | Identifiants | |
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