Hewlett Packard Enterprise DL360p Gen8
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Sponsored HPE ProLiant DL360p Gen8 server Rack (1U) Intel Xeon E5 Family E5-2603V2 1.8 GHz 4 GB DDR3-SDRAM 460 W
1933.30 GBP
Price updated on: 29-07-2026 04:33:01
1933.30 GBP
Price updated on: 29-07-2026 04:33:01
Sponsored HPE ProLiant DL360p Gen8 server Rack (1U) Intel® Xeon® E5 Family E5-2603V2 1.8 GHz 4 GB DDR3-SDRAM 460 W
2027.99 GBP
Price updated on: 10-07-2026 12:22:20
2027.99 GBP
Price updated on: 10-07-2026 12:22:20 | Identifiers | |
|---|---|
| Model | Hewlett Packard Enterprise 733732R-421 |
| MPN | Hewlett Packard Enterprise 733732R-421 |
| Dimensions / Weight | |
| Key Features | |
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Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
|
QPI |
| Cabling technology | 10/100/1000Base-T(X) |
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Chassis type The physical form factor of a computer chassis, indicating its size and layout such as Tower, Desktop, Mini‑PC, or rack units (e.g., 1U, 2U). This attribute helps users identify the footprint, mounting options, and compatibility with other hardware.
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Rack (1U) |
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ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
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Yes |
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Ethernet interface type A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.
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Gigabit Ethernet |
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Ethernet LAN ports Represents the total count of Ethernet LAN (RJ‑45) interfaces available on a product. The value is an integer indicating how many physical Ethernet ports are present, regardless of speed or generation.
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4 |
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Graphics adapter The specific model or designation of the graphics adapter present in a device, such as "Intel HD Graphics", "AMD Radeon Vega 8", or "NVIDIA GeForce GTX 1660". This value helps users understand the visual performance and capabilities that the product can deliver.
|
G200 |
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Graphics adapter family The brand or family of the graphics adapter present in a device, such as Intel, AMD, NVIDIA, Apple, or other vendors. It indicates the general source of the GPU technology and helps users compare visual performance across products.
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Matrox |
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HDD interface List of the physical interface(s) used by a hard drive together with the number of bays it occupies, such as "2 x SATA (2 x Bay)" or "1 x M.2 PCIe". This attribute helps users determine both the connection type and how many drives can be installed in an enclosure or system.
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Serial ATA, Serial Attached SCSI (SAS) |
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HDD size The physical width of a hard disk drive expressed in inches or centimeters. It indicates the standard size that determines which enclosures, bays, and mounting hardware are compatible with the drive.
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2.5" |
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Intel® Hyper Threading Technology Indicates whether the processor supports Intel® Hyper‑Threading Technology, allowing each physical core to handle multiple execution threads simultaneously for improved multitasking performance.
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No |
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Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
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4096 MB |
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Internal memory type The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
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DDR3-SDRAM |
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Maximum CPU configuration The highest number of physical or logical processor cores that a computer system can support or is configured with. It indicates the maximum parallel processing capacity available for running applications and workloads.
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2 |
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Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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384 GB |
| Maximum internal memory supported by processor | 786432 MB |
|
Maximum PCI Express lanes Cantidad total de líneas (lanes) de la interfaz PCI Express disponibles en un dispositivo o placa base. Cada línea permite el flujo de datos entre el procesador y los dispositivos conectados, por lo que este número indica la capacidad máxima de ancho de banda para tarjetas y periféricos compatibles con PCIe.
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40 |
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Memory bandwidth supported by processor The maximum rate at which a processor can transfer data to or from its memory subsystem, expressed as a data transfer speed (e.g., GB/s). It indicates the throughput capacity of the CPU’s memory interface and helps users compare performance potential across different processors.
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42.6 GB/s |
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Memory channels supported by processor The total count of independent memory channels supported by a processor or motherboard, indicating how many separate memory paths can be used simultaneously. This value helps users understand the potential for parallel memory access and overall system performance.
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Quad |
|
Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.
|
800,1066,1333 MHz |
| Memory layout | 1 x 4 GB |
|
Memory slots The number of physical memory slots that are present and available for installing RAM modules in a device. This count indicates how many separate memory sticks can be installed or upgraded.
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24x DIMM |
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Motherboard chipset The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.
|
Intel C600 |
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Physical Address Extension PAE The number of bits used by a processor to address physical memory when Physical Address Extension (PAE) is enabled. This value indicates the maximum virtual address space that can be accessed, typically 32, 36, 40 or 48 bits for x86 CPUs.
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46 bit |
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Processor ARK ID The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.
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76157 |
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Processor boost frequency The highest clock speed a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
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1.8 GHz |
|
Processor cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
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10 MB |
|
Processor cache type Indicates the level or category of a processor’s internal cache memory, such as L1, L2, L3, or Smart Cache. This attribute helps users understand the hierarchy and accessibility of cached data within the CPU, which can influence performance characteristics.
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Smart Cache |
| Processor codename | Ivy Bridge EP |
|
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
|
Intel® Xeon® E5 Family |
| Processor lithography | 22 nm |
|
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
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E5-2603V2 |
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Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute lists the supported modes for the CPU and helps users determine compatibility with software that requires a specific bitness.
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64-bit |
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Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
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52.5 x 45 mm |
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Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.
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Intel Xeon E5-2600 v2 |
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Processor socket The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
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LGA 2011 (Socket R) |
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RAID levels A comma‑separated list that specifies the RAID configurations supported by a storage controller or device. Each entry can be a numeric level (e.g., 0, 1, 5, 10) or a special label such as JBOD. This attribute indicates which disk arrangements the system can manage.
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0,1,1+0 |
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Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
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AVX |
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Tcase The highest temperature at which the product can safely operate without risk of damage or performance degradation. It is expressed in degrees Celsius and applies to all electronic components such as processors, servers, storage devices, and other hardware that generate heat during normal use.
|
71 °C |
|
Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
|
80 W |

Hewlett Packard Enterprise is a technology company that provides a range of products and services to businesses and governments around the world. Some of the company's most popular products include servers, storage systems, and networking equipment. Hewlett Packard Enterprise also offers a variety of services, including consulting, support, and training.

