HyperX Predator HX430C15PB3K2/16 16GB (2x8GB) Memory Module Kit

Sponsored  This site contains affiliate links for which we may receive compensation. More information
Find other available options:
Identifiers
Model HyperX HX430C15PB3K2/16
MPN HyperX HX430C15PB3K2/16
Dimensions / Weight
Key Features
Buffered memory type
The type of buffering applied to a memory module, indicating whether the RAM is unbuffered (unregistered), buffered (registered), or fully buffered. This attribute helps users understand compatibility and performance characteristics for computer systems.
Unregistered (unbuffered)
CAS Latency
The number of clock cycles that a memory module takes to complete a read operation after the address has been sent. It indicates how quickly data can be accessed from RAM and affects overall system performance, especially in high‑speed memory configurations.
15
Component for
Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
PC/server
Cooling type
The method used to dissipate heat from a component or system, such as active cooling (fans or liquid loops), passive heat sinks, or no active cooling. It indicates whether the product relies on airflow, conduction, or other mechanisms to maintain safe operating temperatures.
Heatsink
Country of origin
The country where the product was manufactured or its primary geographic source. This attribute indicates the nation responsible for the production or assembly of the item.
China
Depth
The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
133.3 mm
ECC
Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
No
Height
The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
42.2 mm
Internal memory
The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
16 GB
Internal memory type
The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
DDR4
Lead plating
The material or finish applied to the lead components of a product, such as gold, nickel, copper or other plated metals. It indicates the type of metal coating used for corrosion resistance, conductivity and durability in electronic leads.
Gold
Memory clock speed
The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
3000 MHz
Memory form factor
The physical configuration or size classification of a memory module, such as SO‑DIMM, UDIMM, RDIMM, or on‑board. It indicates the form factor that determines compatibility with motherboards and other hardware components.
288-pin DIMM
Memory voltage
The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.
1.2,1.35 V
Module configuration
Specifies the capacity of each memory module in megabytes (MB) and its data bus width in bits. The value is expressed as a pair separated by an "x", for example "1024M x 64" indicates a 1 GB module with a 64‑bit wide interface.
1024M x 64
Package depth
The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
120.7 mm
Package Height
The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
157.5 mm
Package width
The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
30.5 mm
Row Active Time
The time required for a memory controller to activate a row of cells before data can be accessed, expressed in nanoseconds (ns). It indicates the latency between issuing a read/write command and when the data is available, which affects overall memory performance.
32 ns
Weight
The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.
129.9 g
Width
The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
8.3 mm
HyperX

HyperX is a gaming brand that produces headsets, keyboards, mice, and other gaming peripherals. The company was founded in 2002 and is now a division of Kingston Technology. HyperX is known for its high-quality products and for its sponsorship of professional gaming teams.