Intel SpeedCore 512GB 760P
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| Identifiers | |
|---|---|
| Model | Intel INT-SSDPEKKW512G8XT |
| MPN | Intel INT-SSDPEKKW512G8XT |
| Dimensions / Weight | |
| Key Features | |
|
Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
|
Server/workstation |
|
Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
|
80 mm |
|
End-to-End Data Protection Indicates whether a product provides comprehensive protection for data throughout its entire lifecycle, from creation and storage to transmission and deletion. A value of Yes means the device or system implements mechanisms such as encryption, secure key management, and integrity checks that cover all stages of data handling.
|
Yes |
|
Enhanced Power Loss Data Protection technology Indicates whether the product incorporates a technology that protects against power loss by preserving data integrity during unexpected shutdowns or power interruptions.
|
No |
|
Hardware encryption Indicates whether the device includes a dedicated hardware-based encryption feature that protects data integrity and confidentiality through an embedded component.
|
Yes |
|
Intel High Endurance Technology HET Indicates whether the product incorporates Intel’s High Endurance Technology (HET), a feature that enhances the durability and lifespan of storage devices by optimizing wear‑leveling, error correction, and firmware management. A value of "Yes" means the device supports HET; "No" indicates it does not.
|
No |
|
Interface List of physical or logical interfaces that allow communication between a hard drive and other devices, such as SATA, M.2 PCIe, U.2, SAS, NVMe, or other standard connections.
|
PCI Express 3.1 |
|
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
|
Q1'18 |
|
Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
|
MBL |
|
Maximum operating temperature The highest temperature at which a product can operate safely without risk of damage or performance degradation. Values are expressed in degrees Celsius (°C). This attribute helps users verify that the device will remain within its thermal limits during normal use.
|
70 °C |
| Mean time between failures | 1600000 h |
|
Memory type The classification of a device’s memory technology, such as DDR4 SDRAM, GDDR6, or MLC NAND. It indicates the underlying architecture and generation that determines performance characteristics like bandwidth, latency, and power consumption.
|
3D2 TLC |
|
Non-operating shock The mass of a component or device measured while it is not operating, expressed in grams. This value represents the total weight that the unit can sustain during shock testing and includes any internal parts and packaging if specified.
|
1000 G |
| Non-operating vibration | 3.13 G |
|
NVMe Indica si el producto cuenta con la interfaz de alta velocidad NVM Express (NVMe), lo que permite velocidades de lectura y escritura superiores a las de interfaces tradicionales como SATA.
|
Yes |
|
Operating vibration The mass of a device measured while it is in normal operation, expressed in grams (g). This value indicates the amount of material that contributes to vibration during use and can help assess mechanical stability or compliance with vibration standards.
|
2.17 G |
|
PCI Express interface data lanes Indicates the number of data lanes available on a PCI Express interface, expressed as a string such as "x4", "x8" or "x16". This value represents the bandwidth capacity of the interface and is used to determine compatibility with devices that require a specific lane count.
|
x4 |
| Power consumption (read) | 0.05 W |
|
Power consumption idle The electrical power drawn by a device when it is powered on but not performing any active tasks, expressed in watts (W). This value represents the minimal energy usage during idle or standby periods and can be used to estimate background consumption or compare efficiency across similar products.
|
0.025 W |
|
Security algorithms Una lista de los algoritmos criptográficos y protocolos de seguridad que el producto soporta, como cifrado (AES, WEP), autenticación (WPA2-PSK, EAP-TLS) o protocolos de red (HTTPS, SSH). Cada elemento describe un algoritmo individual; la lista puede contener varios valores separados por comas.
|
256-bit AES |
|
Sequential reading The highest rate at which a storage device can read data sequentially, expressed in megabytes per second (MB/s) or gigabits per second (Gbps). This value indicates how quickly the device can retrieve large contiguous blocks of information for processing or transfer.
|
3230 MB/s |
|
Sequential Writing Speed The maximum rate at which a storage device can write data in a continuous stream, expressed as a data transfer rate such as megabytes per second (MB/s) or gigabits per second (Gbps). This value indicates how quickly the device can persist large files or perform bulk writes and is useful for comparing performance across similar products.
|
1625 MB/s |
|
SSD ARK ID A unique numeric identifier assigned to an SSD by the manufacturer, used for tracking, support, and compatibility purposes across product lines.
|
134582 |
| SSD Capacity | 512 GB |
|
SSD form factor Represents the physical form factor of a solid‑state drive, indicating its size and connector type (e.g., M.2, 2.5", 3.5"). This attribute helps users identify compatibility with motherboards, enclosures, or laptops.
|
M.2 |
|
SSD temperature monitoring Indicates whether a solid‑state drive (SSD) includes built‑in temperature monitoring capability. A value of "Yes" means the SSD can report its operating temperature to the host system or firmware, while "No" indicates no such feature is present.
|
No |
| Status | Launched |
| TBW rating | 288 |
|
Weight The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.
|
10 g |
|
Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
|
22 mm |

Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.




