Intel Xeon E3-1270V5 3.6 GHz Blue SSD
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| Identifiers | |
|---|---|
| Model | Intel BX80662E31270V5 |
| MPN | Intel BX80662E31270V5 |
| Dimensions / Weight | |
| Key Features | |
|
Box Indicates whether a product comes packaged in a closed box or container. A value of "Yes" means the item is supplied with protective packaging; "No" indicates it is not.
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Yes |
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Bus bandwidth The maximum frequency at which a system bus can transfer data, expressed in hertz (Hz). It indicates the theoretical throughput capability of the bus and allows users to compare performance across different processors or components.
|
8 |
|
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
|
DMI3 |
|
Bus type units The interface speed or bandwidth specification of a computer component, such as a processor or memory bus. Common units include GT/s (giga‑transfers per second) for PCIe lanes and MHz for clock frequencies. It indicates the maximum data transfer rate that the component can achieve under ideal conditions.
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GT/s |
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Clock Speed The maximum operating frequency of a central processing unit (CPU) as specified by the manufacturer, expressed in hertz (Hz). This value indicates how many cycles per second the CPU can execute under normal conditions and is useful for comparing performance potential across different models.
|
3.60 GHz |
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Component for Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
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Server/Workstation |
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Core count The total number of physical cores in a processor, expressed either as a numeric value or in descriptive terms such as "Quad Core" or "Hexa Core". This attribute captures the core count information regardless of whether it is presented numerically or textually.
|
Quad Core |
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CPU Speed The maximum operating frequency of a central processing unit (CPU), expressed in hertz (Hz). This value indicates how many cycles per second the CPU can execute under normal conditions and is useful for comparing performance potential across different models.
|
3.6 GHz |
|
Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
|
37.5 mm |
|
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
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Yes |
|
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
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No |
| Enhanced intel speedstep technology | Yes |
|
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.
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Yes |
|
Graphics & IMC lithography The minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
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14 nm |
|
Graphics output A list of the video output connectors and protocols that a device can provide for transmitting visual signals, such as HDMI, DisplayPort, VGA, or USB‑C based outputs. Each entry indicates a distinct connector type or version (e.g., "HDMI 2.1", "DP 1.4"). This attribute helps users identify which displays or external devices the product can support.
|
N/A |
|
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
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Yes |
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Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
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Yes |
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Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.
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No |
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Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.
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Yes |
|
Intel Secure Key Technology version The specific version number of Intel Secure Key technology supported by the processor, indicating the generation and capabilities of the secure key feature set.
|
1.00 |
|
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
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Yes |
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Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.
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Yes |
|
L2 cache The amount of internal memory reserved for a processor’s L2 cache, expressed as a pair of values: the number of banks and the capacity per bank (e.g., "4 x 256 KB"). This format allows specification of both the count of cache banks and the capacity of each bank, which together determine the total L2 cache available to the CPU.
|
1 MB |
|
Launch date The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
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Q4'15 |
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Market segment The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
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SRV |
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Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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65536 MB |
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Maximum internal memory supported by processor The largest amount of internal random‑access memory (RAM) that a processor can address and support, expressed as a data size such as megabytes or gigabytes. It indicates the upper limit of memory capacity for active processes and multitasking performance on devices using this CPU.
|
64 GB |
|
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.
|
16 |
|
Memory channels The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
|
Dual-channel |
|
Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
|
1333,1600,1866,2133 MHz |
|
Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
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DDR3L-SDRAM,DDR4-SDRAM |
|
Memory voltage supported by processor The operating voltage required or supplied to the processor, expressed in volts (V). It indicates the electrical potential that powers the CPU and is essential for ensuring proper performance and compatibility with power delivery systems.
|
1.35 V |
|
On-board graphics adapter 4K support Indicates whether the device’s integrated graphics adapter can output a 4K resolution (3840×2160) image or video. A value of "Yes" means the hardware and drivers support 4K playback or rendering; "No" indicates that 4K is not supported.
|
No |
|
Package depth The linear measurement from front to back or top to bottom of a product’s packaging, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the packaged item is and can be used for fitting, compatibility, or spatial planning.
|
116 mm |
|
Package Height The vertical dimension of a product’s packaging measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and helps customers assess how tall the package will be when stored or shipped.
|
101 mm |
|
Package Type The form of packaging used for a product, such as box, blister pack, bag, or pallet. It indicates how the item is contained and protected during shipping and storage.
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Retail |
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Package width The horizontal measurement of a product’s packaging, expressed in a linear unit such as millimetres or inches. It indicates how wide the package is from one side to the other and helps customers assess fit for storage, shipping, or display.
|
70 mm |
|
PCI Express CEM Revision The PCI Express Common Extensible Module (CEM) revision indicates the version of the PCI Express specification supported by a device or component. It is expressed as a numeric value such as 2.0, 3.0, or 4.0 and determines compatibility with PCIe devices and the maximum achievable bandwidth.
|
3.0 |
|
PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
|
1x16,1x8+2x4,2x8 |
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Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
|
88174 |
|
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
|
4 GHz |
|
Processor brand name The name of the company that designs and produces the central processing unit used in a device, such as Intel, AMD or Qualcomm. It identifies the manufacturer so users can quickly see which brand’s processors are supported by the product.
|
Intel Xeon |
|
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
|
Smart Cache |
|
Processor code A unique identifier that represents the specific model or variant of a computer processor. The code is typically an alphanumeric string (e.g., "SR2ZU", "SR3LA") used by manufacturers to distinguish between different CPU models, generations, and configurations. It can be entered as free text and may appear in product listings, technical specifications, or inventory records.
|
SR2LF |
| Processor codename | Skylake |
|
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
|
Intel® Xeon® E3 v5 |
|
Processor manufacturer The company that designs and produces the central processing unit (CPU) used in a device. This value identifies the brand of the processor, such as Intel, AMD, Qualcomm, or ARM Holdings, allowing users to assess compatibility, performance expectations, and support resources.
|
Intel |
|
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
|
37.5 x 37.5 mm |
|
Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.
|
Intel Xeon E3-1200 v5 |
|
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
|
LGA 1151 (Socket H4) |
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Processor Socket The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
|
Socket H4 LGA-1151 |
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Product Type Indicates the general classification or type of an item, such as "laptop", "projector", "router" or "paint". It helps users quickly identify the nature of the product and compare similar items across categories.
|
Processor |
| Socket | 1151 |
| Status | Launched |
|
Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.
|
R0 |
|
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
|
AVX 2.0,SSE4.1,SSE4.2 |
|
Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
|
80 W |
| Thermal monitoring technologies | Yes |
|
VID voltage range The range of electrical voltage that a CPU can safely accept from its power source, expressed in volts (V). It indicates the minimum and maximum supply voltages compatible with the processor, covering both AC and DC inputs where applicable.
|
0.55 - 1.52 V |

Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.






