RX2520M5-Intel-Silver4208 Server
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| Identifiers | |
|---|---|
| MPN | Fujitsu VFYR2525SC010IN |
| Dimensions / Weight | |
| Key Features | |
| Cabling technology | 10/100/1000Base-T(X) |
|
Chassis type The physical form factor of a computer chassis, indicating its size and layout such as Tower, Desktop, Mini‑PC, or rack units (e.g., 1U, 2U). This attribute helps users identify the footprint, mounting options, and compatibility with other hardware.
|
Rack (2U) |
|
Ethernet interface type A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.
|
Gigabit Ethernet |
|
Ethernet LAN Indicates whether the product includes an Ethernet LAN interface for wired network connectivity, allowing data transmission over RJ‑45 or compatible cables.
|
Yes |
|
Intel® Turbo Boost Technology The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
|
2.0 |
|
Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
|
16384 MB |
|
Internal memory type The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
|
DDR4-SDRAM |
|
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
|
384 GB |
| Maximum internal memory supported by processor | 1048576 MB |
|
Maximum PCI Express lanes Cantidad total de líneas (lanes) de la interfaz PCI Express disponibles en un dispositivo o placa base. Cada línea permite el flujo de datos entre el procesador y los dispositivos conectados, por lo que este número indica la capacidad máxima de ancho de banda para tarjetas y periféricos compatibles con PCIe.
|
48 |
|
Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.
|
2400 MHz |
|
Memory slots The number of physical memory slots that are present and available for installing RAM modules in a device. This count indicates how many separate memory sticks can be installed or upgraded.
|
12 |
|
Motherboard chipset The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.
|
Intel® C624 |
|
Operating relative humidity The range of relative humidity (in percentage) within which the product is designed to operate reliably. Values are expressed as a minimum–maximum interval such as "20 - 80 %" and indicate the acceptable environmental moisture level for optimal performance.
|
10 - 85% |
|
Operating system installed The operating system that is installed on the device, indicating the software platform that manages hardware resources and provides services for applications. It can be a commercial OS such as Windows or macOS, an open‑source distribution like Linux, or a proprietary firmware used in embedded devices.
|
No |
|
Operating temperature The range of temperatures in which a product can safely operate without risk of damage or performance degradation. Values are expressed in degrees Celsius (°C) and may represent a single temperature, a minimum–maximum interval, or an average operating point.
|
5 - 45 °C |
|
Optical drive type The type of optical drive included in a device, such as DVD‑RW, DVD‑Writer, Blu‑Ray RW, or no optical drive. This attribute indicates whether the product can read or write optical media and specifies the particular model or capability when available.
|
DVD-RW |
| PCI Express slots version | 3 |
|
PCI Express x16 Gen 3.x slots The count of expansion slots on a device that support the PCI Express interface with a configuration of 16 lanes (x16) and are compliant with the Generation 3.x specification. This value indicates how many high‑bandwidth devices, such as graphics cards or other x16 peripherals, can be installed simultaneously.
|
1 |
|
Processor ARK ID The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.
|
193390 |
|
Processor boost frequency The highest clock speed a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
|
3.2 GHz |
|
Processor cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
|
11 MB |
| Processor codename | Cascade Lake |
|
Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
|
Intel Xeon Silver |
| Processor lithography | 14 nm |
|
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
|
4208 |
|
Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute lists the supported modes for the CPU and helps users determine compatibility with software that requires a specific bitness.
|
64-bit |
|
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
|
76.0 x 56.5 mm |
|
Processor socket The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
|
LGA 3647 (Socket P) |
| Processor threads | 16 |
|
RAID levels A comma‑separated list that specifies the RAID configurations supported by a storage controller or device. Each entry can be a numeric level (e.g., 0, 1, 5, 10) or a special label such as JBOD. This attribute indicates which disk arrangements the system can manage.
|
0,1,10 |
|
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
|
AVX-512 |
|
Tcase The highest temperature at which the product can safely operate without risk of damage or performance degradation. It is expressed in degrees Celsius and applies to all electronic components such as processors, servers, storage devices, and other hardware that generate heat during normal use.
|
78 °C |
|
Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
|
85 W |
|
USB 3.2 Gen 1 The total count of USB 3.2 Gen 1 (also known as USB 3.1 Gen 1 or SuperSpeed) ports available on the device, indicating how many peripherals can be connected simultaneously via this interface.
|
6 |

Fujitsu is a Japanese multinational information technology equipment and services company. It is the world's fourth largest IT services provider measured by revenues.

