Xeon E3‑1220v5 1‑Way Server Tower (Lenovo)
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| Identifiers | |
|---|---|
| Model | Lenovo 70TT000DEA |
| MPN | Lenovo 70TT000DEA |
| Dimensions / Weight | |
| Key Features | |
|
Bus Type The interface or communication bus that a component uses to connect with other parts of a system, such as PCI Express, USB, SATA, or legacy buses like FSB and QPI. It indicates the protocol and physical connection used for data transfer between devices.
|
QPI |
|
Cabling technology The type of cable or connector technology used by the product, such as Ethernet standards (e.g., 10/100Base‑T, 1000BASE‑T, 10GBase‑T) or other networking cable types. It indicates the physical medium and protocol supported for data transmission.
|
10/100/1000Base-T(X) |
|
Certification A list of official certifications or compliance marks that the product has received from regulatory bodies, safety organizations, or industry standards groups. Each entry represents a distinct certification such as CE, FCC, RoHS, UL, or WEEE, and may include additional details like version numbers or specific test reports.
|
RoHS, GREENGUARD |
|
Chassis type The physical configuration or shape of a computer chassis, such as tower, rack‑mount (e.g., 1U, 2U), desktop, mini‑PC, or other compact designs. It indicates the overall size and mounting style that determines compatibility with motherboards, power supplies, and case accessories.
|
Tower (4U) |
|
Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
|
593 mm |
|
ECC Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
|
Yes |
|
ECC supported by processor Indicates whether the processor in a device supports Error Correcting Code (ECC) memory, allowing detection and correction of single-bit errors during data storage or transfer.
|
Yes |
|
Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
|
No |
| Energy Star certified | Yes |
| Enhanced intel speedstep technology | Yes |
|
Ethernet interface type A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.
|
Gigabit Ethernet |
|
Ethernet LAN Indicates whether the product includes an Ethernet LAN interface for wired network connectivity, allowing data transmission over RJ‑45 or compatible cables.
|
Yes |
|
Execute disable bit Indicates whether the processor’s Execute Disable bit is enabled, allowing the CPU to prevent execution of code from memory regions marked as non-executable.
|
Yes |
|
Graphics & IMC lithography The minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
|
14 nm |
|
HDD interface List of the physical interface(s) used by a hard drive together with the number of bays it occupies, such as "2 x SATA (2 x Bay)" or "1 x M.2 PCIe". This attribute helps users determine both the connection type and how many drives can be installed in an enclosure or system.
|
Serial ATA III,Serial Attached SCSI (SAS) |
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HDD size The physical width of a hard disk drive expressed in inches or centimeters. It indicates the standard size that determines which enclosures, bays, and mounting hardware are compatible with the drive.
|
2.5" |
|
Height The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
|
443.5 mm |
|
Hot-swap Indicates whether the product can have storage units inserted or removed while it is powered on and running without needing to shut down or reboot the system.
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Yes |
|
Idle states A list of the various low‑power or standby modes that a device can enter to conserve energy when not actively performing tasks.
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Yes |
|
Intel 64 Indicates whether the processor is compatible with the Intel® 64 architecture, enabling it to run operating systems and applications designed for x86‑64 processors.
|
Yes |
|
Intel clear video technology Indicates whether the product incorporates Intel’s Clear Video HD technology, a hardware feature that enhances video playback and capture quality by providing smoother motion, reduced artifacts, and improved color accuracy.
|
No |
|
Intel enhanced halt state Indicates whether the processor includes Intel’s Enhanced Halt State feature, which allows the CPU to enter a low‑power idle mode when not actively executing instructions, thereby reducing energy consumption without compromising performance.
|
Yes |
|
Intel trusted execution technology Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
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Yes |
|
Intel TSX-NI Indicates the specific version of Intel Transactional Synchronization Extensions – No Interlock (TSX‑NI) supported by a processor, which determines its capability for efficient transaction processing and concurrency control.
|
Yes |
|
Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
|
8 GB |
|
Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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64 GB |
|
Maximum number of PCI Express lanes The total count of PCI Express lanes available on a device or component, indicating the maximum number of high‑speed communication channels that can be used simultaneously for peripherals such as graphics cards, storage devices, and networking adapters.
|
16 |
|
Memory channels supported by processor The total number of independent memory channels that a processor or motherboard supports for installing RAM modules. Each channel can handle one or more memory sticks, allowing the system to access data in parallel and improving performance.
|
Dual |
|
Memory clock speed The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
|
2133 MHz |
|
Memory clock speeds supported by processor The set of operating frequencies that a processor can run at, expressed in hertz (Hz). Values are typically listed as individual frequencies or ranges separated by commas, indicating the base clock and any boost or turbo options available for the CPU.
|
1333,1600,1866,2133 MHz |
|
Memory types supported by processor A list of the types of memory modules that a device can use, such as DDR4 SDRAM, LPDDR3, or other compatible standards. Each entry represents a distinct memory technology supported by the hardware.
|
DDR3L-SDRAM,DDR4-SDRAM |
|
Memory voltage supported by processor The operating voltage required or supplied to the processor, expressed in volts (V). It indicates the electrical potential that powers the CPU and is essential for ensuring proper performance and compatibility with power delivery systems.
|
1.35 V |
|
Number of main power supplies The total count of primary power supply units included with the product. This value indicates how many separate power sources are available to provide electrical power, allowing for redundancy or increased capacity.
|
2 |
|
Number of processors installed The total count of physical processor units that are installed in a device. It represents how many separate CPU cores or chips are present, regardless of model or generation.
|
1 |
|
On-board graphics adapter The model name or number of the integrated graphics adapter built into a device, such as a laptop, desktop, or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
|
Yes |
|
On-board graphics adapter model The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
|
Aspeed AST2400 |
|
Operating altitude The range of altitudes (in meters) at which a product or component can operate reliably without performance degradation due to changes in atmospheric pressure, temperature, or other altitude‑related effects.
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0 - 3048 m |
|
Operating system installed The operating system that is installed on the device, indicating the software platform that manages hardware resources and provides services for applications. It can be a commercial OS such as Windows or macOS, an open‑source distribution like Linux, or a proprietary firmware used in embedded devices.
|
No |
|
Optical drive type The type of optical drive included in a computer or related device, such as DVD‑RW, DVD‑Writer, Blu‑Ray RW, or no optical drive. This attribute indicates whether the product can read or write optical media and specifies the particular model or capability when available.
|
DVD±RW |
|
PCI Express configurations A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
|
1x16,1x8+2x4,2x8 |
|
PCI Express slots version The version of the PCI Express specification supported by a device or component. It indicates the maximum bandwidth and compatibility with PCIe devices such as graphics cards, storage controllers, and expansion cards. The value is typically expressed as a numeric revision (e.g., 2.0, 3.0, 4.0) but may also include descriptive labels for specific generations.
|
3.0 |
|
Power supply The electrical power consumption or output of the product, expressed in watts (W). It indicates how much energy the device uses during operation or how much power it can deliver to connected equipment.
|
450 W |
|
Processor ARK ID The Processor ARK ID is a numeric identifier assigned by Intel to each processor model. It uniquely distinguishes one CPU from another and can be used to look up detailed specifications, compatibility information, or firmware updates for that specific chip.
|
88172 |
|
Processor boost frequency The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
|
3.5 GHz |
|
Processor cache type The type or level of the internal cache memory in a processor, such as L1, L2, L3, or Smart Cache. This attribute indicates the hierarchical structure and naming convention used by the CPU manufacturer to describe its cache organization.
|
Smart Cache |
| Processor codename | Skylake |
|
Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
|
3 GHz |
|
Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
|
E3-1220V5 |
|
Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
|
37.5 x 37.5 mm |
|
Processor series The processor series identifies the family or generation of a CPU, such as "Intel Xeon E5-2600" or "AMD Ryzen 5000". It is used to group models that share similar architecture, performance characteristics and compatibility features.
|
Intel Xeon E3-1200 v5 |
|
Processor socket The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
|
LGA 1151 (Socket H4) |
|
Rack mounting Indicates whether a product is designed to be mounted in a rack system. The value can be "Yes" or "No", or it may specify the height occupied by the device using rack units (U) such as "1U", "2U", or a numeric measurement with unit, e.g., "61.25 mm".
|
Yes |
|
RAID levels A comma‑separated list that specifies the RAID configurations supported by a storage controller or device. Each entry can be a numeric level (e.g., 0, 1, 5, 10) or a special label such as JBOD. This attribute indicates which disk arrangements the system can manage.
|
0,1,10 |
|
RAID support A comma‑separated list of RAID levels that a storage device or controller can support, such as 0, 1, 5, 10, JBOD, and other proprietary configurations. Each value represents a distinct RAID mode the system is capable of creating or managing.
|
Yes |
|
Stepping Der CPU‑Stepping bezeichnet die interne Version eines Prozessormodells, die bei jeder neuen Fertigungsrunde geändert wird. Er gibt an, welche Revision des Chips verwendet wurde und kann Einfluss auf Leistung, Energieverbrauch oder Kompatibilität haben.
|
R0 |
|
Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
|
AVX 2.0,SSE4.1,SSE4.2 |
|
Supported RAID controllers A comma‑separated list of the RAID controller models or families that a storage system can host, such as Dell PERC H330, HP Smart Array P255i, or Fujitsu PRIDE EP420i. Each value represents a distinct controller capable of managing multiple disks and providing features like mirroring, striping, or parity. The list may include model numbers with optional suffixes (e.g., "H730P+ 2GB") that indicate specific variants or memory configurations. Users can reference this attribute to determine which RA
|
RAID520i |
| Thermal monitoring technologies | Yes |
|
Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
|
173 mm |

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