HyperX Impact HX316LS9IBK2/16 Memory 1600 MHz DDR3L CL9 SODIMM 1.35 V, 16 GB Kit

The type of buffering applied to a memory module, indicating whether the RAM is unbuffered (unregistered), buffered (registered), or fully buffered. This attribute helps users understand compatibility and performance characteristics for computer systems.

The operating frequency of a system bus, expressed in hertz (Hz). It indicates how many cycles per second the bus can transfer data between components such as memory and peripherals. This value helps users compare performance potential across devices that use different bus speeds.

The number of clock cycles that a memory module takes to complete a read operation after the address has been sent. It indicates how quickly data can be accessed from RAM and affects overall system performance, especially in high‑speed memory configurations.

The arrangement or grouping of integrated chips within a component, such as a motherboard or memory module. This attribute helps users understand how the chips are physically and functionally organized, providing insight into the product’s architecture and potential performance characteristics.

Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.

Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.

Indicates whether a device or component reports the presence of errors during operation or data handling. A value of "Yes" means that the product detects and signals errors, while a value of "No" indicates no such error reporting is available.

The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.

The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.

The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.

The material or finish applied to the lead components of a product, such as gold, nickel, copper or other plated metals. It indicates the type of metal coating used for corrosion resistance, conductivity and durability in electronic leads.

List of Linux operating systems that the product can run or support, including specific versions and architectures when relevant. Each value represents a distinct Linux distribution or kernel version supported by the hardware or software.

A list of macOS operating system versions that the product supports or is compatible with, such as "macOS 10.15 Catalina", "macOS 11 Big Sur" or newer releases. Each entry represents a distinct OS version that can run on or be supported by the device.

The width of the memory bus, expressed in bits. It indicates how many data lines are available for transferring information between the processor and memory modules at once, affecting overall memory bandwidth.

The physical configuration or size classification of a memory module, such as SO‑DIMM, UDIMM, RDIMM, or on‑board. It indicates the form factor that determines compatibility with motherboards and other hardware components.

The total number of individual memory sticks that make up a memory kit or are installed in a device, expressed as an integer count.

The classification of a device’s memory technology, such as DDR4 SDRAM, GDDR6, or MLC NAND. It indicates the underlying architecture and generation that determines performance characteristics like bandwidth, latency, and power consumption.

The electrical voltage required by the RAM modules of a device, expressed in volts (V). It indicates the operating supply voltage that the memory needs to function correctly and safely.

Specifies the capacity of each memory module in megabytes (MB) and its data bus width in bits. The value is expressed as a pair separated by an "x", for example "1024M x 64" indicates a 1 GB module with a 64‑bit wide interface.

The form of packaging used for a product, such as box, blister pack, bag, or pallet. It indicates how the item is contained and protected during shipping and storage.

The time required for a memory controller to activate a row of cells before data can be accessed, expressed in nanoseconds (ns). It indicates the latency between issuing a read/write command and when the data is available, which affects overall memory performance.

The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.

A list of Microsoft Windows operating system versions that the product is compatible with, including any relevant architecture or edition information.