Intel Core i9-11900K processor 3.5 GHz 16 MB Smart Cache Box

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Identifiers
MPN Intel BX8070811900K
Dimensions / Weight
Key Features
Cache
The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
16 MB
Clock speed
The maximum operating frequency of a central processing unit (CPU) as specified by the manufacturer, expressed in hertz (Hz). This value indicates how many cycles per second the CPU can execute under normal conditions and is useful for comparing performance potential across different models.
3.5 GHz
Commodity Classification Automated Tracking System (CCATS) G167599
Component for
Specifies the type of device or system that the product is intended to be used with, such as a PC, server, notebook, surveillance system, or other electronic equipment. The value represents a single category and can be used to filter or group products by their target platform.
PC
Configurable TDP-down
The maximum electrical power that a device can consume or supply when its thermal design power is configured to a lower setting, expressed in watts (W). This value indicates the energy capacity of the product under reduced operating conditions and helps users compare efficiency, size power supplies, and estimate operational costs.
95 W
Cooler No
Core size 14 nm
Cores
The total count of processing cores present in a graphics processing unit (GPU). This value indicates how many independent execution units are available for parallel rendering, compute tasks, and other GPU‑accelerated operations.
8 Core
Country of origin
The country where the product was manufactured or its primary geographic source. This attribute indicates the nation responsible for the production or assembly of the item.
Malaysia
Depth
The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
4.5 mm
Discrete graphics adapter model Not available
Execution units
Represents the count of independent execution units within a processor or similar component. The value is an integer without any unit of measure, indicating how many discrete execution cores or threads are available for parallel processing.
32
Export Control Classification Number (ECCN)
A code that identifies the classification of a product for export control purposes, indicating its regulatory status and any restrictions on sale or shipment.
5A992CN3
Harmonized System HS code
The Harmonized System (HS) code is a standardized numerical identifier used internationally to classify traded goods. It consists of up to six digits, where each pair of digits represents progressively more specific product categories. The HS code facilitates customs duties, trade statistics, and regulatory compliance by providing a common language for describing products across borders.
85423119
Heatsink
Indicates whether the product includes a heatsink component for thermal management.
No
Height
The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
11.6 mm
Intel® vPro™ Platform Eligibility Yes
Launch date
The calendar date on which a product was first made available to the public or released for sale. It is expressed in the format YYYY-MM-DD and can be used to filter, sort, or display the launch timeline of the item.
Q1''21
Market segment
The target market segment for a product, such as "Business", "Home", or "Small‑medium business". This attribute helps customers quickly identify the intended user group and typical use case of the item.
Desktop
Max TDP
The maximum thermal design power (TDP) is the amount of heat a processor or other component is expected to generate under typical load conditions. It represents the cooling requirement and helps users select appropriate cooling solutions and power supplies.
125W
Maximum CPU configuration
The highest number of physical or logical processor cores that a computer system can support or is configured with. It indicates the maximum parallel processing capacity available for running applications and workloads.
1
Maximum displays supported
The maximum count of external or internal display units that a device can drive simultaneously. This value indicates how many monitors, screens, or video outputs the system is capable of supporting at once.
3
Maximum internal memory
The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
131072 MB
Maximum on-board graphics adapter memory
The maximum amount of dedicated video memory that the integrated graphics adapter built into a device can provide, expressed as a data size (e.g., megabytes or gigabytes). This value indicates how much graphical processing power is available for rendering, gaming, and other GPU‑intensive tasks.
65536 MB
Maximum PCI Express lanes
Cantidad total de líneas (lanes) de la interfaz PCI Express disponibles en un dispositivo o placa base. Cada línea permite el flujo de datos entre el procesador y los dispositivos conectados, por lo que este número indica la capacidad máxima de ancho de banda para tarjetas y periféricos compatibles con PCIe.
20
Memory
The amount of random‑access memory (RAM) physically installed in a device, expressed as a data size such as megabytes or gigabytes. It indicates how much information the system can hold for active processes and affects multitasking performance.
DDR4-3200
Memory bandwidth maximum. 50 GB/s
Memory channels
The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
Dual-channel
Memory clock speeds supported by processor
A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.
3200 MHz
Memory types supported by processor DDR4-SDRAM
On-board graphics adapter base frequency
The clock speed at which the integrated graphics processor runs under normal conditions, expressed in hertz (Hz). It indicates how many cycles per second the GPU performs and is useful for comparing visual performance across devices that use an on‑board graphics solution.
350 MHz
On-board graphics adapter dynamic frequency
The operating speed at which the integrated graphics processor in a device runs, expressed in hertz (Hz). It indicates how many cycles per second the GPU can perform and is used to assess visual performance, power consumption, and compatibility with display refresh rates.
1300 MHz
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel) 5120 x 3200 pixels
On-board graphics adapter maximum resolution (HDMI) 4096 x 2160 pixels
On-board graphics adapter refresh rate at maximum resolution (DisplayPort)
The highest refresh rate that the integrated graphics adapter can output at its maximum supported resolution over a DisplayPort connection. It indicates how many times per second the image is refreshed on the display, affecting motion smoothness and visual quality.
60 Hz
Onboard graphics adapter model
The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
Intel UHD Graphics 750
Package type
The form of packaging used for a product, such as box, blister pack, bag, or pallet. It indicates how the item is contained and protected during shipping and storage.
Retail box
PCI Express configurations
A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
1 x 4,2 x
Processor ARK ID
The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.
212325
Processor boost frequency
The highest clock speed a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
5.3 GHz
Processor cache type
Indicates the level or category of a processor’s internal cache memory, such as L1, L2, L3, or Smart Cache. This attribute helps users understand the hierarchy and accessibility of cached data within the CPU, which can influence performance characteristics.
Smart Cache
Processor family
The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
Intel Core i9
Processor model
Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
i9-11900K
Processor operating modes
The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute lists the supported modes for the CPU and helps users determine compatibility with software that requires a specific bitness.
64-bit
Processor socket
The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
LGA 1200 (Socket H5)
Refresh rate
The number of times per second that a display updates its image, expressed in hertz (Hz). It indicates the smoothness and responsiveness of motion on the screen; higher rates generally provide a more fluid visual experience.
60Hz 2Ms Response Time
Socket 1200
Status Launched
Supported instruction sets
A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
SSE4.1, SSE4.2, AVX 2.0, AVX-512
Target market
The segment of consumers or businesses for whom the product is intended, such as Gaming, Content Creation, Cloud/Datacenter, Small and Medium Business, or Entry-level users. It helps shoppers quickly identify whether a product fits their needs and allows filtering by target audience.
Gaming, Content Creation
Tjunction
The maximum ambient temperature at which the product can safely operate without risk of damage or performance degradation.
100 °C
Width
The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
10.2 mm
Intel

Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.