Edi2BB Intel Edison Starter Pack

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Identifiers
Model Intel EDI2BB.AL.K
MPN Intel EDI2BB.AL.K
Dimensions / Weight
Key Features
64-bit computing
Indicates whether the product can run software or operating systems that require a 64‑bit architecture.
No
Audio port type I2S
Bluetooth Yes
Bluetooth version
The specific version of the Bluetooth standard supported by the product, indicating its capabilities for wireless communication and compatibility with other devices. Values may be numeric (e.g., 4.2, 5.0) or include additional descriptors such as "+HS" or feature lists.
4.0
Compatible memory cards
List of the memory card types that a device can read or write, such as MicroSD (TransFlash), SD, MMC, CompactFlash, and others. Each value represents a format that the device’s slot or reader supports for storage expansion.
SD,SDHC
DC input voltage
The electrical potential difference that a device is designed to accept from its power source, expressed in volts (V). It indicates the nominal operating voltage for the product and helps users verify compatibility with local mains or battery supplies.
3.15-4.5 V
ECC
Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
No
ECC supported by processor
Indicates whether the processor in a device supports Error Correcting Code (ECC) memory, allowing detection and correction of single-bit errors during data storage or transfer.
No
Embedded options available
Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
No
Ethernet LAN
Indicates whether the product includes an Ethernet LAN interface for wired network connectivity, allowing data transmission over RJ‑45 or compatible cables.
No
Flash memory
The total amount of internal flash memory available in a device, expressed as a data size (e.g., megabytes or gigabytes). This attribute indicates how much data can be stored on the device’s built‑in flash storage.
4096 MB
Flash Memory Type
The specific type or technology of the flash memory used in a device, such as V‑NAND, TLC 3D NAND, QLC 3D NAND, XPoint, or microSD. It identifies the underlying storage architecture and can influence performance, endurance, and compatibility.
NAND
Frequency Range
The span of frequencies, expressed in hertz (Hz), that a device can operate within or respond to. It may be given as a single value, a numeric range (e.g., "20 000‑50 000 Hz"), or an open‑ended interval such as "2.4 GHz+" indicating the lower bound only.
2.4 - 5 GHz
FSB Parity
Indica se la memoria del computer è configurata con parità FSB (Front Side Bus). Un valore "Sì" significa che la memoria utilizza la tecnologia di parità, mentre un valore "No" indica l'assenza di questa funzionalità.
No
Height
The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
3.9 mm
Intel trusted execution technology
Indicates whether the product incorporates Intel’s Trusted Execution Technology, a security feature that creates isolated execution environments to protect sensitive code and data from tampering or unauthorized access.
Yes
Internal memory type
The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
LPDDR3
Linux operating systems supported
List of Linux operating systems that the product can run or support, including specific versions and architectures when relevant. Each value represents a distinct Linux distribution or kernel version supported by the hardware or software.
Yes
Maximum internal memory
The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
4 GB
Memory bus
The width of the memory bus, expressed in bits. It indicates how many data lines are available for transferring information between the processor and memory modules at once, affecting overall memory bandwidth.
32 bit
Memory channels
The configuration of memory channels supported by a device, indicating how many independent memory paths the system can use for data transfer (e.g., Dual‑channel, Quad‑channel). This attribute helps users understand the potential bandwidth and performance characteristics of the memory subsystem.
Dual-channel
Memory clock speed
The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
800 MHz
Output current
The electrical current drawn by a device from its power source, expressed in amperes (A). It indicates how much current the product consumes during normal operation and helps determine compatibility with power supplies or USB ports.
100 mA
Output voltage
The electrical potential difference that a device delivers to its load, expressed in volts (V). It indicates the nominal voltage supplied by the product’s power output and is useful for matching it with compatible accessories or systems.
1.8 V
Processor frequency
The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
500 MHz
Processor lithography
The lithography process defines the minimum feature size that can be etched onto a semiconductor chip, expressed in nanometers (nm). It indicates the manufacturing technology generation and influences performance, power consumption, and integration density of the processor.
22 nm
Processor model
Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
Intel Atom®
Processor package size
The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
25 x 35.5 mm
Processor socket
The physical connector used by a processor to attach to a motherboard or other compatible platform. Common examples include LGA 1151, BGA 1440, Socket AM4, and LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility.
70-pin Hirose .4mm
Status Discontinued
USB Version
The specific version of the USB standard that a product supports, expressed as a generation number and optional descriptive suffix (e.g., "3.2 Gen 1" or simply "3.0"). This attribute indicates the data‑transfer capabilities and compatibility with USB devices.
2.0
Wi-Fi
Indicates whether the product has built‑in Wi‑Fi capability, allowing it to connect to wireless networks without requiring external adapters or dongles.
Yes
Wi-Fi standards
A list of the wireless networking protocols and frequency bands that a device can connect to, such as 802.11a, 802.11b, 802.11g, Wi‑Fi 4 (802.11n), Wi‑Fi 5 (802.11ac) or Wi‑Fi 6 (802.11ax). The values are typically separated by commas and may include both the technical name and a consumer‑friendly label.
802.11a,802.11g,802.11b,Wi-Fi 4 (802.11n)
Intel

Intel is a computer chip manufacturer that also produces motherboard chipsets, network interface controllers and other integrated circuits. It is the world's largest semiconductor company.