HPE ProLiant DL20 Gen10 E-2236 Performance Server

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Identifiers
MPN HP P17081-B21
Dimensions / Weight
Key Features
Chassis type
The physical form factor of a computer chassis, indicating its size and layout such as Tower, Desktop, Mini‑PC, or rack units (e.g., 1U, 2U). This attribute helps users identify the footprint, mounting options, and compatibility with other hardware.
Rack (1U)
ECC
Indicates whether the memory module or component supports Error‑Correcting Code (ECC) for detecting and correcting single-bit errors during operation. A value of "Yes" means ECC is enabled, allowing automatic correction of data corruption; a value of "No" indicates no ECC support.
Yes
Embedded options available
Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
No
Ethernet interface type
A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.
Gigabit Ethernet
Ethernet LAN ports
Represents the total count of Ethernet LAN (RJ‑45) interfaces available on a product. The value is an integer indicating how many physical Ethernet ports are present, regardless of speed or generation.
2
HDD interface
List of the physical interface(s) used by a hard drive together with the number of bays it occupies, such as "2 x SATA (2 x Bay)" or "1 x M.2 PCIe". This attribute helps users determine both the connection type and how many drives can be installed in an enclosure or system.
Serial ATA
HDD size
The physical width of a hard disk drive expressed in inches or centimeters. It indicates the standard size that determines which enclosures, bays, and mounting hardware are compatible with the drive.
2.5"
Intel® Turbo Boost Technology
The maximum operating frequency that a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
2.0
Internal memory
The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
16384 MB
Internal memory type
The type of memory physically installed inside a device, such as DDR4 SDRAM, LPDDR3, or other RAM variants. It indicates the architecture and generation of the internal memory modules that the product uses or supports.
DDR4-SDRAM
Maximum graphics adapter memory
The amount of dedicated video memory available on a graphics adapter or GPU, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the GPU can store for textures, frame buffers and other rendering tasks, affecting performance in gaming, 3D applications and high‑resolution displays.
16 MB
Maximum internal memory
The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
64 GB
Maximum internal memory supported by processor 128 GB
Maximum storage capacity
The largest amount of digital storage that a product can hold or provide, expressed as a numeric value with an appropriate unit such as GB, MB, TB, or a descriptive label indicating the type of media (e.g., SSD, HDD). This attribute helps users understand how much data can be stored on the device and compare storage options across products.
12 TB
Memory clock speed
The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
2666 MHz
Memory layout 1 x 16 GB
Motherboard chipset
The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.
Intel C242
Onboard graphics adapter model
The model name or number of the integrated graphics adapter built into a device, such as a laptop or motherboard. It identifies the specific GPU variant used for rendering and video processing, allowing users to compare visual performance and compatibility across products.
Not available
PCI Express configurations
A textual description of how PCI Express lanes are distributed across the available slots or interfaces in a device. The value typically lists groups of lanes separated by commas, where each group may contain a number of lanes and optional ‘+’ signs to indicate combined lanes that share the same speed (e.g., "1x16", "2x8", "1x8+2x4"). This attribute helps users understand the bandwidth capacity and compatibility of expansion slots.
1x16,2x8,1x8+2x4
PCI Express slots version 3.0
Processor ARK ID
The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.
191040
Processor boost frequency
The highest clock speed a processor can reach when its turbo or boost feature is active, expressed in hertz (Hz). This value indicates the peak performance capability of the CPU under load and helps users compare how fast a processor can run beyond its base clock speed.
4.8 GHz
Processor cache type
Indicates the level or category of a processor’s internal cache memory, such as L1, L2, L3, or Smart Cache. This attribute helps users understand the hierarchy and accessibility of cached data within the CPU, which can influence performance characteristics.
Smart Cache
Processor codename Coffee Lake
Processor cores
The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.
6
Processor family
The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
Intel Xeon E
Processor lithography 14 nm
Processor package size
The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
37.5 x 37.5 mm
Processor socket
The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
LGA 1151 (Socket H4)
RAID levels
A comma‑separated list that specifies the RAID configurations supported by a storage controller or device. Each entry can be a numeric level (e.g., 0, 1, 5, 10) or a special label such as JBOD. This attribute indicates which disk arrangements the system can manage.
0,1,5,10
Remote administration
Indicates the specific remote administration solution or interface that a device supports, such as iLO, iDRAC, or other proprietary management controllers. The value typically names the model or product line of the controller, allowing users to identify compatibility with their infrastructure and management tools.
iLO 5 ASIC
Supported instruction sets
A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
SSE4.1,SSE4.2,AVX 2.0
Sustainability certificates
A list of environmental, safety or quality certifications that a product has obtained from recognized authorities. Typical entries include RoHS, ENERGY STAR, CE, WEEE, TCO Certified, FCC, and other industry‑specific standards.
ENERGY STAR
Tcase
The highest temperature at which the product can safely operate without risk of damage or performance degradation. It is expressed in degrees Celsius and applies to all electronic components such as processors, servers, storage devices, and other hardware that generate heat during normal use.
73 °C
Thermal design power
The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
80 W
Tjunction
The maximum ambient temperature at which the product can safely operate without risk of damage or performance degradation.
100 °C
HP

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