ProLiant ML350 Gen10 3104 1U 8GB Tower CPU Server
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Sponsored HPE ProLiant ML350 Gen10 server 0 GB Tower (4U) Intel® Xeon® 3104 1.7 GHz 8 GB DDR4-SDRAM 500 W
2125.99 GBP
Price updated on: 23-12-2025 22:40:12
2125.99 GBP
Price updated on: 23-12-2025 22:40:12 | Identifiers | |
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| Model | HPE 877619-031 |
| MPN | HPE 877619-031 |
| Dimensions / Weight | |
| Key Features | |
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Chassis type The physical form factor of a computer chassis, indicating its size and layout such as Tower, Desktop, Mini‑PC, or rack units (e.g., 1U, 2U). This attribute helps users identify the footprint, mounting options, and compatibility with other hardware.
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Tower (4U) |
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Conflict free processor Indicates whether the processor in the device is certified as conflict‑free, meaning it has been tested and confirmed to operate without conflicts or incompatibilities with other system components. A value of "Yes" means the processor meets the conflict‑free standard; "No" indicates it does not.
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Yes |
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Depth The linear measurement of an object from front to back or top to bottom, expressed in a physical unit such as millimeters, centimeters, inches, etc. It indicates how deep the item is and can be used for fitting, compatibility, or spatial planning.
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648 mm |
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Embedded options available Indicates whether the product includes embedded options such as firmware features, hardware modules or configuration settings that are built into the device and available for use without external accessories.
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No |
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Ethernet interface type A list of the Ethernet standards that a product supports, such as Fast Ethernet (10/100 Mbps), Gigabit Ethernet (1 Gbps), 2.5 GbE, 10 GbE, and other variants. Each value is a free‑text label describing one supported interface; multiple values are separated by commas when the device offers more than one speed or generation.
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Gigabit Ethernet |
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Hard drive interface The physical or logical interface used by a hard drive to connect with other components, such as SATA, SAS, USB, PCI Express, or M.2. It indicates the technology that enables data transfer and power delivery between the device and its host system.
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Serial ATA |
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Hard drive size The physical width of a hard drive measured in inches or millimetres, typically expressed as the diagonal size of the drive’s enclosure (e.g., 2.5" or 3.5"). This measurement indicates the form factor that determines compatibility with computer bays, external enclosures, and mounting brackets.
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3.5" |
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Height The vertical dimension of a product measured from its lowest to highest point. It is expressed in a physical unit such as millimetres, centimetres or inches and applies to any item where height is relevant, including books, electronics, furniture and other objects.
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462.5 mm |
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Internal memory The total amount of internal memory available in a device, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the component can hold for active processes and affects multitasking performance.
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8 GB |
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Maximum graphics adapter memory The amount of dedicated video memory available on a graphics adapter or GPU, expressed as a data size such as megabytes (MB) or gigabytes (GB). It indicates how much information the GPU can store for textures, frame buffers and other rendering tasks, affecting performance in gaming, 3D applications and high‑resolution displays.
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16 MB |
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Maximum internal memory The largest amount of internal random‑access memory that a device can support, expressed as a data size such as megabytes or gigabytes. It indicates the maximum capacity for active processes and multitasking performance.
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768 GB |
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Maximum number of SMP processors The total count of symmetric multiprocessing (SMP) processors supported by a computer system or component. This value indicates how many CPU cores can operate concurrently in an SMP configuration, which is relevant for multi‑core performance and parallel processing capabilities.
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2 |
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Maximum PCI Express lanes Cantidad total de líneas (lanes) de la interfaz PCI Express disponibles en un dispositivo o placa base. Cada línea permite el flujo de datos entre el procesador y los dispositivos conectados, por lo que este número indica la capacidad máxima de ancho de banda para tarjetas y periféricos compatibles con PCIe.
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48 |
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Maximum storage capacity The largest amount of digital storage that a product can hold or provide, expressed as a numeric value with an appropriate unit such as GB, MB, TB, or a descriptive label indicating the type of media (e.g., SSD, HDD). This attribute helps users understand how much data can be stored on the device and compare storage options across products.
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144 TB |
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Memory channels supported by processor The total count of independent memory channels supported by a processor or motherboard, indicating how many separate memory paths can be used simultaneously. This value helps users understand the potential for parallel memory access and overall system performance.
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Hexa |
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Memory clock speed The maximum operating frequency of a memory module, expressed in hertz (Hz). It indicates how many cycles per second the RAM can perform and is typically reported as MHz or GHz. This value helps users compare performance potential across different memory types and system configurations.
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2600 MHz |
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Memory clock speeds supported by processor A list of the operating frequencies that a processor can run at, expressed in hertz (Hz). The values are typically given as MHz or GHz and may include multiple speeds separated by commas to indicate base, boost, or other supported clock rates. This attribute helps users compare the performance potential of different CPUs and understand the range of speeds they can achieve under various workloads.
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2133 MHz |
| Memory layout | 1 x 8 GB |
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Memory slots The number of physical memory slots that are present and available for installing RAM modules in a device. This count indicates how many separate memory sticks can be installed or upgraded.
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24 |
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Motherboard chipset The model of the motherboard’s chipset, indicating the family of supported processors and integrated features such as I/O interfaces, memory support, and peripheral connectivity.
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Intel C622 |
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Number of processors installed The total count of physical processor units that are installed in a device. It represents how many separate CPU cores or chips are present, regardless of model or generation.
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1 |
| PCI Express slots version | 3.0 |
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Power supply The electrical power consumption or output of the product, expressed in watts (W). It indicates how much energy the device uses during operation or how much power it can deliver to connected equipment.
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500 W |
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Processor ARK ID The unique numeric identifier assigned by Intel to each processor model, used for precise identification and lookup of technical specifications.
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123546 |
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Processor cache The amount of internal memory reserved for a processor’s cache, expressed in units such as megabytes (MB) or gigabytes (GB). This value indicates how much data the CPU can store locally to accelerate access and improve performance.
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8.25 MB |
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Processor cache type Indicates the level or category of a processor’s internal cache memory, such as L1, L2, L3, or Smart Cache. This attribute helps users understand the hierarchy and accessibility of cached data within the CPU, which can influence performance characteristics.
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L3 |
| Processor codename | Skylake |
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Processor cores The total number of physical processing units in a single central processing unit (CPU). This value indicates how many independent tasks the CPU can handle simultaneously, influencing multitasking and parallel performance.
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6 |
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Processor family The processor family identifies the group or series of CPU models that share a common architecture, design, and performance characteristics. It helps users compare processors across brands and generations by indicating the underlying technology used in the chip.
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Intel® Xeon® |
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Processor frequency The fundamental operating frequency of a processor, expressed in hertz (Hz). It indicates the speed at which the CPU runs under normal conditions and is typically reported in gigahertz (GHz) or megahertz (MHz). This value helps users compare performance potential across different models.
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1.70 GHz |
| Processor lithography | 14 nm |
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Processor model Identifies the exact model of the central processing unit used in a device, including brand and numeric designation such as "Intel Core i5-8250U" or "AMD Ryzen 7 3700X". This value allows users to distinguish between different processor families, generations, and performance levels.
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3104 |
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Processor operating modes The set of instruction set architectures or execution modes that a processor can operate in, such as 32‑bit or 64‑bit. This attribute lists the supported modes for the CPU and helps users determine compatibility with software that requires a specific bitness.
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64-bit |
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Processor package size The overall dimensions of a processor’s physical package, expressed as length × width × height in millimetres or inches. It indicates the size that must fit within a motherboard socket or mounting area and helps users compare compatibility across different CPU models.
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76.0 x 56.5 mm |
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Processor socket The physical connector used by a processor to attach to a motherboard or compatible platform, such as LGA 1151, BGA 1440, Socket AM4, or LGA 1200. This attribute indicates the exact socket designation required for proper CPU installation and compatibility with other hardware components.
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LGA 3647 |
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Stepping The processor stepping code identifies the specific revision of a CPU model, indicating changes in manufacturing that may affect performance, power consumption or compatibility. It is used to distinguish between different silicon revisions within the same product line.
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U0 |
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Supported instruction sets A list of processor instruction set extensions that a CPU can execute, such as AVX, AVX2, SSE4.1, SSE4.2, and AVX‑512. Each value represents an individual extension or group of extensions supported by the hardware.
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AVX,AVX 2.0,AVX-512,SSE4.2 |
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Tcase The highest temperature at which the product can safely operate without risk of damage or performance degradation. It is expressed in degrees Celsius and applies to all electronic components such as processors, servers, storage devices, and other hardware that generate heat during normal use.
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78 °C |
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Thermal design power The maximum amount of power, expressed in watts (W), that a processor or other electronic component is designed to dissipate as heat under typical operating conditions. It represents the thermal load the cooling system must handle and is used by manufacturers and users to assess performance, energy consumption, and suitability for specific environments.
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85 W |
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Weight The mass of the product expressed in a standard unit such as grams or kilograms. It represents how heavy the item is and can be used for shipping calculations, handling instructions, or consumer information.
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21 kg |
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Width The horizontal measurement of a product, expressed in a linear unit such as millimetres or inches. It indicates how wide the item is from one side to the other and is used for sizing, fitting, and compatibility purposes.
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174 mm |

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